Wafer Mounters

Wafer mounters used to prepare wafers for dicing

Manual Wafer Mounter

Flexible, smart and efficient, for a variety of different wafers, frames and tapes. Over 20 years of design expertise.

Manual Non-Contact Wafer Mounter

Sensitive wafer surfaces require touchless processing. By securing the 5mm border of the wafer via vacuum, the remaining fragile wafer surface can be mounted with our non-contact process.

P-200 Non-Contact for up to Ø8″

P-300 Non-Contact for up to Ø300mm

Semi-Automatic Vacuum Wafer Mounter

Fully automatic core process with a high degree of process quality. Suitable for the highest requirements in process stability, reproducibility, and homogenous adhesion for a variety of flat wafers and substrates. The cycle time typically takes less than 90 seconds.

V-200 for up to Ø8″

V-200T for TAIKO wafers up to Ø8″

V-300 for up to Ø300mm

High Throughput Wafer Mounter

Gel-Pak carriers can be placed directly on the chuck so that fragile wafers do not need to be transferred and potentially damaged in the process. Originally designed for Gallium Arsenide wafers (GaAs), the device can be used for any thin, fragile, or broken wafer that is on a Gel-Pak carrier and needs to be mounted onto a metal frame using sticky tape.

WM-650 GaAs for up to Ø6″

Vacuum Bonders

Semi-automatic bonders that bond wafer to tape using controlled heat and vacuum

Vacuum Bonder VH-Series

Designed to provide top quality and highly reproducible results when bonding films and carriers.

V-200H Bonder for up to Ø8″

V-300H Bonder for up to Ø300mm

Advanced Vacuum Bonder VA-Series

The highest level of process control and repeatability while still offering flexibility, all in a table-top device. Automatic opening and closing of the lid, independent temperature settings for bottom versus top chucks, and the ability to change all parameters in Process Development mode or lock all parameters to run in Production mode.

VA-200 Advanced Bonder up to Ø8″