This device is specifically designed to maximize the degree of automation in the bonding process for structured substrates or bumped wafers. Only the handling steps remain manual — this ensures equipment longevity and saves on space and cost for the customer. In fact, the V-300H does not consist of any electromechanical actuators, which guarantees a maximum MTBF (mean time between failures) and no periodic consumables.

• Customers who choose this device typically demand:
• Proper contact between the tape and around the structures (bumps) on the wafer
• High degree of process repeatability and independence of human errors
• The substrate must be uniformly brought into contact with the tape over its entire surface (no transversal movement)
• A device which does not require any adjustment for different substrate thicknesses

Applications

The V-300H is well suited to R&D and pilot-line environments, as well as low-to-mid volume production, where flexibility across substrate types matters more than cassette-to-cassette throughput. Its lot-size-one capability makes it a practical fit for process development and qualification trials before scaling to full production. Beyond standard silicon wafers, the V-300H accommodates a range of substrate materials — including glass and ceramic — provided they fall within the specified thickness and structure height limits.

Operation

It is important to understand that the V-300H requires a frame to be mounted with a tape beforehand. Once that is prepared, the substrate and the mounted frame are placed onto separate sides of the V-300H chamber. Once the cover is closed, the V-300H will evacuate the chamber to approximately 3 mbar and then automatically bring both the structured substrate and the tape into uniform contact with each other. By applying a vacuum, a bubble-free and homogeneous bond is ensured. Finally, the chamber can be opened and the substrate bonded onto the tape and frame can be retrieved. Parameters such as temperature, pressing force, vacuum level, and timing can all be adjusted via the device HMI or the temperature control unit.

Flexibility

A special strength of the V-300H is its modular design. The exchange of chucks for different substrates can be done within less than 1 minute. There is no height adjustment necessary of the chuck. It is important to note that different substrate sizes do not always require a different chuck to be used. Besides the standard heated chuck, ask about our wide range of customized chucks of any special shapes. The V-300H operates independently of any specific type of tape, so long as it is intended for heated processes.

Limitations

The V-300H requires a frame to already be mounted with tape before use — a separate frame mounter (such as the Manual Wafer Mounter P-200 or Frame-Mounter TM-852) is needed to prepare this beforehand, as the V-300H does not perform this step itself. Additionally, since bonding is achieved through vacuum only, with no mechanical press mechanism, the maximum applied pressure is limited to atmospheric pressure.