V-200T_2

V-200T_1

V-200T_3

V-200T_4

V-200T_5

V-200T_6

Semi-Automatic TAIKO Wafer Vacuum Mounter V-200T

Designed to provide top quality and highly reproducible results when mounting films onto sensitive, structured, or bumped substrates.

Mounting process in a vacuum chamber down to 2mbar
No adjustment necessary for different wafer thicknesses
Suitable for all types of tapes or films
Table-top device, minimal footprint
Note: Frame must be mounted with tape previously

Video

Technical Data

Wafer size:	up to 8"
Wafer type:	flat, curved, warped
Wafer thickness:	80µm to 3mm
Frame size:	Ø8" DTF 2-8-1 / Ø6" DTF 2-6-1 (on request)
Frame material:	Steel, Plastic
Width:	360 mm
Depth:	600 mm
Height:	815 mm
Weight:	29 kg
Vacuum requirement:	2 mbar absolute, Festo PUN-8, Ø8 mm
Pressure requirement:	4 - 6 bar, Festo PUN-6, Ø6 mm
Power input:	110 - 240 VAC, 50/60 Hz
Clean room application:	in use up to ISO 4 - 5
A-weighted emission sound pressure level:	does not exceed 70 dB(A), excluding vacuum pump
Peak c-weighted instantaneous sound pressure value at workstations:	does not exceed 63 Pa, excluding vacuum pump
Certification:	CE Certified, IEC 204-1 safety standards

Product Description

This device is specifically designed to maximize the degree of automation in the mounting process for structured, bumped, and curved wafers. Only the pure handling steps are manual to ensure equipment longevity, and save on space and cost for the customer. In fact, the V-200T does not consist of any electromechanical actuators, which, guarantees a maximum MTBF (mean time between failures) and no periodic consumables.

Customers who choose this device typically demand:

a proper contact between the tape and around the structures (bumps) on the wafer
a high degree of process repeatability and independence of human errors
the wafer must be uniformly brought into contact with the tape over its entire surface (no transversal movement)
a device which does not require any adjustment for different wafer thicknesses

Operation

It is important to understand that the V-200T requires a frame to be mounted with a tape beforehand. That can be done on a Manual Wafer Mounter P-200 or any other mounter on the market. Once that is prepared, the wafer and the mounted frame are placed into the V-200T chamber. Once the cover is closed, the device will evacuate the chamber to approximately 2-3 mbar and then automatically bring both the structured wafer and the tape into uniform contact with each other. By applying a vacuum, a bubble-free and homogeneous mount is ensured. Finally, the chamber can be opened and the wafer mounted onto the tape and frame can be retrieved. Parameters such as pressing force, vacuum level, and timing can all be adjusted via the device HMI.

Flexibility

A special strength of the V-200T is its modular design. The exchange of chucks for different wafers can be done within less than 1 minute. It is important to note that different wafer sizes do not always require a different chuck to be used. Besides the standard chuck, ask about our wide range of customized chucks of any special shapes. The V-200T operates independently of any specific type of tape.

Limitations

If your processed wafer surface is absolutely not allowed to be touched during any step of the mounting, we suggest to check out our Manual Wafer Mounter P-200 Non-Contact.

Options & Accessories

Options

Chuck for 6″ Wafers with 8″ Frame

The V-200T can be supplied with a standard 8″ chuck or with a 6″ chuck. The aluminum chuck features an anodized finish and a minimal border to ensure proper alignment and centering of the wafer.

Chuck for 6″ Wafers with 6″ Frame

The V-200T can be adapted to support 6″ frames with a 6″ wafer chuck.

Chuck for Curved Wafers

Special chucks can be provided that match the radius of curvature of the wafer so that it is properly supported during the mounting process and consistently aligned. Wafers with a diameter as small as 2 inches with a radius of curvature of 1.5m can be supported.

Accessories

Vacuum Pump (up to ISO 6 clean room)

0.55 kW, 110-240 V, 50/60 Hz. Performance optimized for use with the V-200. Supplied with a active carbon filter and gas particle absorber developed by POWATEC. Allows thereby clean room application up to ISO 6.

Vacuum Pump (up to ISO 1 clean room)

110-240 V, 50/60 Hz. Performance optimized for use with the V-200. Adapted and commissioned by POWATEC for V-200 operation. Allows thereby high clean room class application.

Product Variants

Customizations possible for:

Wafer bonding applications
Larger substrate thickness
Custom wafer shapes
Wafer theta alignment features on the chuck
Fully automated solution with 6-axis robot system.

Downloads & FAQs

Downloads

POWATEC Semi-Automatic TAIKO Wafer Vacuum Mounters_V-200T_V-300T

FAQs

Can I have my samples tested by POWATEC?
YES. If you are seriously interested in acquiring a V-200T, but would like to have it tested with your own samples first, then we can offer a free sample testing at our facility. We also support you in the selection of suitable tapes/films, offer free dicing or UV curing, and support you to select the most suitable model for your needs. Furthermore, as a proof of record, we can offer a live stream or video recording to document your samples being processed with the V-200T. Alternatively, we are more than happy to welcome you to visit our facility for an in-person demonstration.

Does the V-200T also mount the tape to the frame?
NO. To use the V-200T, it is necessary to first mount the tape to the frame. It is therefore recommended to have either a POWATEC Manual Wafer Mounter (P-200), or a Frame Mounter (FM-200). However, any other wafer mounter on the market should be able to prepare the tape on the frame.

Do I need a separate chuck for each wafer size?
YES. However small differences in the wafer size (+/- 2 mm) can be handled with one type of chuck. But for different wafer sizes such as 4″, 6″ or 8″ a dedicated chuck is necessary. The exchange of the chuck is done within seconds.

Do I need to make adjustments for different wafer thicknesses?
NO. No adjustments are needed, which is a great advantage of the V-200T.

Does POWATEC offer chucks for square wafer / glass substrate / multiple substrates at once / very small wafers or fraction of wafers?
YES.

Does the V-200T have a heated chuck option?
YES. This variant is referred to as our V-200TH Semi-Automatic Heated TAIKO Wafer Vacuum Mounter.

What has to be done by the operator?

Place the wafer and the mounted frame in the chamber
Close the chamber and press start
Open the chamber when the process is finished and retrieve the wafer on tape and frame

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