Semi-Automatic Heated Vacuum Wafer Mounter V-200H

Designed to provide top quality and highly reproducible results when mounting thermal film on structured substrates or bumped wafers. 

  • No adjustment necessary for different wafer thicknesses
  • Suitable for all heatable types of UV tapes or thermal tapes
  • Table-top device, minimal footprint
  • Note: Frame must be mounted with tape previously
  • Heat controlling unit included

Wafer size: 6" to 8" mm
Wafer type: flat surface
Wafer thickness: 80µm to 3mm
Maximum height of structures/bumps: 170µm
Maximum temperature: 100°C / 212°F
Frame size: Ø8" DTF 2-8-1 / Ø6" DTF 2-6-1 (on request)
Frame material: Steel
Width: 470 mm
Depth: 750 mm
Height: 1100 mm
Weight: 40 kg
Vacuum requirement: 2 mbar absolute, Festo PUN-8, Ø8 mm
Pressure requirement: 4-6 bar, Festo PUN-6, Ø6 mm
Power input: 110-240 VAC
Clean room application: in use up to ISO 4 - 5
A-weighted emission sound pressure level: does not exceed 70 db(A), excluding vacuum pump
Peak c-weighted instantaneous sound pressure value at workstations: does not exceed 63 Pa, excluding vacuum pump
Certification: CE Certified, IEC 204-1 safety standards

This device is specifically designed to maximize the degree of automation in the mounting process for structured or bumped wafers. Only the pure handling steps are manual to ensure equipment longevity, and save on space and cost for the customer. In fact, the V-200H does not consist of any electromechanical actuators, which, guarantees a maximum MTBF (mean time between failures) and no periodic consumables.

Customers who choose this device typically demand:

  • a proper contact between the tape and around the structures (bumps) on the wafer
  • a high degree of process repeatability and independence of human errors
  • the wafer must be uniformly brought into contact with the tape over its entire surface (no transversal movement)
  • a device which does not require any adjustment for different wafer thicknesses

Operation


It is important to understand that the V-200H requires a frame to be mounted with a tape beforehand. That can be done on a Manual Wafer Mounter P-200, Frame-Mounter TM-852, or any other mounter on the market. Once that is prepared, the wafer and the mounted frame are placed onto separate sides of the V-200H chamber. Once the cover is closed, the V-200H will evacuate the chamber to approximately 3 mbar and then automatically bring both the structured wafer and the tape into uniform contact with each other. By applying a vacuum, a bubble-free and homogeneous mount is ensured. Finally, the chamber can be opened and the wafer mounted onto the tape and frame can be retrieved. Parameters such as temperature, pressing force, vacuum level, and timing can all be adjusted via the device HMI or the temperature control unit.

Flexibility


A special strength of the V-200H is its modular design. The exchange of chucks for different wafers can be done within less than 1 minute. There is no height adjustment necessary of the chuck. It is important to note that different wafer sizes do not always require a different chuck to be used. Besides the standard heated chuck, ask about our wide range of customized chucks of any special shapes. The V-200H operates independently of any specific type of tape, so long as it is intended for heated processes.

Limitations


If your processed wafer surface is absolutely not allowed to be touched during any step of the mounting, we suggest to check out our Manual Wafer Mounter P-200 Non-Contact.

Options


Conversion Kit for 6" Wafer, with 8" Frame DTF 2-8-1

6" Chuck, 6" top plate

Accessories


Vacuum Pump (up to ISO 6 clean room)

0.55 kW, 110-240 V, 50/60 Hz. Performance optimized for use with the V-200. Supplied with a active carbon filter and gas particle absorber developed by POWATEC. Allows thereby clean room application up to ISO 6.

Vacuum Pump (up to ISO 1 clean room)

110-240 V, 50/60 Hz. Performance optimized for use with the V-200. Adapted and commissioned by POWATEC for V-200 operation. Allows thereby high clean room class application.

 

Variants on commission:

  • The V-200H can also be provided for DTF 2-6-1 (6" Frames)
  • Larger substrate thickness
  • Wafer theta alignment features on the chuck
  • fully automated solution with 6-axis robot system. Casette to casette handling.

FAQs


Can I have my samples tested by a V-200H at POWATEC?
YES. If you are seriously interested in acquiring a V-200H, but would like to have it tested with your own samples first, then we can offer a free sample testing at our facility. We also support you in the selection of suitable tapes/films, offer free dicing or UV curing, and support you to select the most suitable V-200 model for your needs. Furthermore, as a proof of record, we can offer a live stream or video recording to document your samples being processed with the V-200H. Alternatively, we are more than happy to welcome you to visit our facility for an in-person demonstration.

Does the V-200H also mount the tape thttps://www.powatec.com/products/wafer-mounter/manual-wafer-mounter-p-200o the frame?
NO. To use the V-200H, it is necessary to first mount the tape to the frame. It is therefore recommended to have either a POWATEC Manual Wafer Mounter (P-200), or a Frame Mounter (FM-200). However, any other wafer mounter on the market should be able to prepare the tape on the frame.

Do I need a separate chuck for each wafer size?
YES. However small differences in the wafer size (+/- 2 mm) can be handled with one type of chuck. But for different wafer sizes such as 4", 6" or 8" a dedicated chuck is necessary. The exchange of the chuck is done within seconds.

What is the minimum wafer thickness the device can support?
The minimum wafer thickness on the standard device is 80µm, however, with minor adaptations there is no limit to the minimum thickness of a wafer that can be mounted.

What is the maximum thickness of the wafer?
With the standard chuck it is possible to mount wafers up to 3mm in thickness and structures/bumps with a maximum height of 170µm. Larger dimensions are possible with a simple customized design.

Do I need to make adjustments for different wafer thicknesses?
NO. No adjustments are needed, which is a great advantage of the V-200H.

Does POWATEC offer chucks for square wafer / glass substrate / multiple substrates at once / very small wafers or fraction of wafers?
YES.

Is it possible to mount Taiko wafers with the V-200H?
In principle, yes. However, this depends on the tape, so we recommended customers to contact POWATEC to schedule a free sample test to evaluate the V-200H and our Semi-Automatic Vacuum Taiko Wafer Mounter V-200T.

What has to be done by the operator?

  1. Place the wafer and the mounted frame in the V-200H chamber
  2. Close the chamber and press start
  3. Open the chamber when the process is finished and retrieve the wafer on tape and frame

Video

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