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Wafer Singulation Equipment
All our machines are engineered and produced in Switzerland by POWATEC with minimal footprint for clean room applications
Each device is customizable and we offer free sample testing or video conferences to identify the best fit for our customer’s needs
Powatec wafer mounters are used to prepare wafers for dicing by ensuring the tape is applied air-void free to the wafer and corresponding dicing frame. We offer manual and semi-automatic devices for standard & TAIKO wafers, non-contact setups (NCS), and bumped or structured wafers.
Powatec wafer mounters are used to prepare wafers for dicing by ensuring the tape is applied air-void free to the wafer and corresponding dicing frame. We offer manual and semi-automatic devices for standard & TAIKO wafers, non-contact setups (NCS), and bumped or structured wafers.
Powatec wafer laminators are used to apply air-void free protective or back grinding tapes onto wafers.
Powatec expansion tools are used to uniformly stretch the tape on which a singulated wafer is mounted, thereby increasing the space between dies and facilitating further handling.
Powatec offers a wide range of cassettes/magazines used to ensure the proper storage and handling of mounted wafers according to the size of the frame.
Powatec offers a wide range of cassettes/magazines used to ensure the proper storage and handling of mounted wafers according to the size of the frame.
