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Manual Wafer Mounter P-300

Used to mount a wafer onto a frame with commercially available tapes
  • Short setup times and high versatility – perfect for high mix or medium volume
  • Bubble-free application of tape on wafers & corresponding frames up to 8″
  • Carbon tissue used to protect the sensitive surface during the mounting process
  • Patented roller design & adjustable chuck ensure proper force application
  • Over 20 years of design optimization to ensure the highest quality mount

Video

Wafer size: up to 300 mm
Wafer type: Flat surface on the mounting side
Wafer thickness: 50µm to 4.5mm
Film/Tape Width: 150 mm - 400 mm
Frame size: Ø300mm DTF 2-12 & DTF 2-12-1 / Ø8" DTF 2-8-1 with insert ring / K&S
Width: 590 mm
Depth: 880 mm (1000 mm with PTW)
Height: 250 mm
Weight: 25 kg (33 kg with PTW)
Film width: 200 to 400 mm
Vacuum requirement: -70 kPa
Vacuum connection: Outer diameter ø 6 mm
Power input for PTW option: 85 - 240 VAC
Power input for ESD bar: 230 VAC
Clean room application: In use up to ISO 4 - 5
A-weighted emission sound pressure level: Does not exceed 70 dB(A)
Peak c-weighted instantaneous sound pressure value at workstations: Does not exceed 63 Pa
Certification: CE Certified, IEC 204-1 safety standards

Despite all of the automation and the importance of accurate handling, human haptic capabilities are, in many cases, superior to sophisticated automated systems. This device is specifically designed to ergonomically maximize the advantages of the operator’s capabilities and to minimize life cycle costs. This device has a proven record of nearly zero break down time since its inception over 20 years ago. The only periodic consumables are the blades and the carbon tissue of the chuck. Customers interested in the P-300 often inquire as to how the force exerted onto the sensitive wafer is controlled while manually mounting with the pad roller. The design ensures that the chuck (on which the wafer sits) is vertically adjustable against the frame of the entire device; this not only allows for quick adjustments to accommodate different wafer thicknesses, but it also controls the amount of force applied to the wafer versus the force conveyed to the frame. This allows some of our customers to mount even the most brittle Wafers (< 100µ, Gallium Arsenide, etc.) including in production environments, where the device can serve the capacity of 3 dicing saws.

Flexibility

A unique strength of the P-300 is its modular design. By simply adding an insert ring into the chuck table, it is also possible to mount wafers on DTF 2-8-1 (8″) frames as well. Switching between DISCO or K&S frame types is possible via the exchangeable positioning pins. Exchanging chucks for different wafers can be done in less than 1 minute, including the height adjustment of the chuck. However, it is important to note that different wafer sizes do not always require a different chuck to be used! Besides the standard chuck with the protective carbon tissue layer, Powatec offers a wide range of standard and custom chucks such as ceramic surface, heated chuck, or even in special shapes. The P-300 can also handle various type of standard or UV release films between 200 and 400mm wide, and with the reference lines engraved onto the tape reel holder it is easy to switch between your different tapes and always have it mounted correctly.

Limitations

If your processed wafer surface is absolutely not allowed to be touched during any step of the mounting, we recommend you check out our P-300 Non-Contact Wafer Mounter. If you process wafers with bumped surfaces (such as lenses), check our Semi-Automatic Vacuum Wafer Mounter V-300 or our Semi-Automatic Heated Vacuum Wafer Mounter V-300H.

Options

PTW (Protection Tape Winder)
When using UV release film, the use of the PTW is recommended. It automatically winds up the UV protection film via a high quality integrated drive. The PTW is mounted on the back of the wafer mounter.
ESD Bar
Unwinding of the film can lead to electrostatic charges. To limit such electrostatic charges it is recommended the use of an ionizing air bar. The bar is installed in the proximity of the tape peel-off point where the greatest electrostatic charges occur. The corresponding control unit is included in the scope of delivery.

Insert ring for 8″ Frame

To mount up to 8″ wafers with a DTF 2-8-1 or K&S Frame. The exchange time is less than 1min.

Measurement tool for ESD bar

It is recommended to perform a periodic functional check of the ionizing bar.

Standard Chuck Sizes

Our chucks are available in the following sizes: 2″, 4″, 6″, 8″, or 300mm

Ceramic Chuck
Powatec’s ceramic chucks are commonly used to ensure the vacuum holding the wafer is homogenously applied across the entire substrate, which, is critical in handling thin/sensitive wafers and ensuring the tape is evenly applied. The flatness of our ceramic chucks are ensured down to 3 microns.
Heated Chuck
A heated laminator chuck is available in all standard sizes. With the heating controller provided by Powatec, this chuck can reach temperatures up to 80°C (175°F). Greater values are possible as a custom option.

Consumables

Cutting blade set
Circular cutting blades and lateral cutting blades in a separate box. The exchange is simple and properly described in the operations manual.
300mm Wafer protection layer set / 8″ Wafer protection layer set / 2″-6″ Wafer protection layer set
The carbon tissue protects the surface of the wafer and the porous layer underneith ensures an even vacuum distribution of the chuck surface. Both layers are recommended to be exchanged periodically. A set consists of 5 carbon tissues and 10 porous layers. The exchange is simple and properly described in the operations manual.
For inquiries on these products or customizations, please contact Powatec for full details.

This P-300 customization example allows to mount a wafer in a way that the wafer is only mounted on its border of 5mm. That means the wafer has no tape on its surface except the border. The solution uses two lids on each side for perfect concentric alignment of the process steps.

This customized chuck example allows to mount 16 substrates in one mounting process with high positioning accuracy

Downloads

Powatec P-Series Manual Wafer Mounter

FAQs

Can I have my samples tested by a P-300 at POWATEC?
YES. If you are seriously interested in acquiring a P-300, but would like to have it tested with your own samples first, then we can offer a free sample testing at our facility. We also support you in the selection of suitable tapes/films and offer free dicing or UV curing, if needed. Furthermore, as a proof of record, we can offer a live stream or video recording to document your samples being processed with the P-300. Alternatively, we are more than happy to welcome you to visit our facility for an in-person demonstration.

How do I ensure not to apply too much force on the wafer when mounting with the pad roller?
Note that with a well-adjusted chuck height, the pad roller – even operated manually – will transmit a significant portion of the force directly onto the frame and NOT onto the wafer. Note as well that some of the components (elasticity of pad roller, carbon tissue, porous layer and chuck itself) do absorb force as well, which controls the effective force onto the wafer itself. With a well-adjusted chuck height, any excess of force application by the pad roller is transmitted onto the frame and not onto the wafer. In addition, the pad roller tends to bend such that the force in the center of the pad roller decreases. Usually, the issue is not too much force onto the wafer but the contrary: insufficient force application which then leads to air bubbles being present.
For very sensitive wafer surfaces that cannot be touched at all, POWATEC recommends the Non-contact configuration.

What is the minimum wafer thickness the device can support?
The minimum wafer thickness on the standard device is 50µm, however, the device can support thinner wafers with some customization. Contact your Powatec representative for more information.

What is the maximum wafer thickness the device can support?
The maximum wafer thickness on the standard device is 4.5mm, however, the device can support thicker wafers with some customization. Contact your Powatec representative for more information.

Does POWATEC offer heated chuck options?
YES

Does POWATEC offer chucks for square wafer / glass substrate / multiple substrates at once / very small wafers or fraction of wafers?
YES

Is it possible to mount Taiko or Bumped wafers with the P-300?
No. For such wafers it is recommended to consult POWATEC for alternative solutions.

Can the P-300 be upgraded to include the PTW or ESD options after it is delivered?
YES, however please contact POWATEC to ensure the compatibility.

Can the P-300 be converted into a L-300?
YES, simply replacing the chuck and the circular cutting knife module is sufficient. Please contact POWATEC for further details.

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