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Manual Wafer Mounter
Flexible, smart and efficient, for a variety of different wafers, frames and tapes. Over 20 years of design expertise.
Manual Non-Contact Wafer Mounter
Sensitive wafer surfaces require touchless processing. By securing the 5mm border of the wafer via vacuum, the remaining fragile wafer surface can be mounted with our non-contact process.
Vacuum Wafer Mounter
Fully automatic core process with a high degree of process quality. Suitable for the highest requirements in process stability, reproducibility, and homogenous adhesion for a variety of flat wafers and substrates. The cycle time typically takes less than 90 seconds.
Heated Vacuum Wafer Mounter
Designed to provide top quality and highly reproducible results when mounting thermal film on structured substrates or bumped wafers.
Silicon Carbide Wafer Mounter V-150 SiC
The highest level of process control and repeatability while still offering flexibility, all in a table-top device. Automatic opening and closing of the lid, independent temperature settings for bottom versus top chucks, and the ability to change all parameters in Process Development mode or lock all parameters to run in Production mode.
High Throughput Wafer Mounter
Gel-Pak carriers can be placed directly on the chuck so that fragile wafers do not need to be transferred and potentially damaged in the process. Originally designed for Gallium Arsenide wafers (GaAs), the device can be used for any thin, fragile, or broken wafer that is on a Gel-Pak carrier and needs to be mounted onto a metal frame using sticky tape.
